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Details

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microtech GmbH electronic
Oderstraße 42
D-14513 Teltow
Germany
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CMF
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) - low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available - also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
Dimensions (in mm):
Size
L
Length
W
Width
H
Depth
t
Contact back
T
Contakt
front
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0402
0,95
1,10
0,45
0,60
0,25
0,40
0,10
0,35
0,05
0,35
0603
1,50
1,70
0,75
0,95
0,35
0,55
0,10
0,50
0,10
0,50
0805
1,85
2,15
1,10
1,40
0,35
0,65
0,15
0,60
0,15
0,60
1206
2,90
3,35
1,45
1,75
0,35
0,65
0,25
0,75
0,15
0,75
1210
3,00
3,30
2,35
2,65
0,50
0,75
0,35
0,85
0,25
0,85
1218
3,00
3,30
4,50
4,80
0,50
0,75
0,35
0,85
0,25
0,85
2010
4,80
5,20
2,30
2,70
0,50
0,75
0,35
0,85
0,25
0,85
2512
6,10
6,50
3,00
3,30
0,50
0,75
0,35
0,85
0,25
0,85
Packaging units:
Reel
Card tape
Blister tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
4 T pcs.
10 T pcs. for size 0402
330 mm
10 T pcs.
8 T pcs.
20 T pcs.
16 T pcs.
Samples on request
Ordering information:
CMF
- N
0603
10k
0,1%
10ppm/K
K
P
5
(optional)
Type
Contact
Size
R-Value
± Tolerance
± TCR
Marking
Packaging
pcs. / Reel
(T pcs.)
CMF
Standard (without add.)
-N (non magnetic)
-K (epoxy bondable)
0402
.
to
.
2512
1R
.
to
.
4M7
0,05
0,1
0,25
0,5
1
10
15
25
50
K- with
(from size 0603)
N- without
(only size 0402)
P- Card tape
B- Blister tape
S- Bulk
Depends on size and packaging unit
Technical data – depending on size:
Precision
application
Professional application
Size
Umax
(V)
P70
(W)
Umax
(V)
P70
(W)
R-Range
R-Tolerance
(±%)
TCR
(± ppm/K)
Packaging
P
B
S
0402
12,5
0,016
50
0,063
100R – 47k0
0,1 / 0,25 / 0,5 / 1
155)
x
x
100R – 221k
0,1 / 0,25 / 0,5 / 1
25
x
x
100R – 511k
0,1 / 0,25 / 0,5 / 1
50
x
x
10R0 – 1M00
1
50
x
x
0603
25,0
0,032
75
0,100
100R – 332k
0,05 / 0,1 / 0,25 / 0,5 / 1
10 / 15 4)
x
x
10R0 – 511k1)
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
1R00 – 1M501) 2)
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
0805
35,0
0,050
150
0,125
100R – 511k
0,05 / 0,1 / 0,25 / 0,5 / 1
10 / 15 4)
x
x
10R0 – 1M001)
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
1R00 – 2M001) 2)
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1206
50,0
0,100
200
0,250
100R – 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
10 / 15 4)
x
x
10R0 – 2M001)
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
1R00 – 4M701) 2)
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1210
50,0
0,100
200
0,500
100R – 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
10 / 15 4)
x
x
2010
100,0
0,150
300
0,500
10R0 – 2M001)
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
2512
100,0
0,250
500
1,000
10R0 – 4M701)
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1218
50,0
0,300
200
1,000
100R – 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
10 / 15 4)
x
x
1) 10R – 100R from ±0,1% tolerance 2) 1R – 10R from ±0,5% tolerance 4) TCR ±5 on request 5) TCR ±10 on request
3) For continuous operation a sufficient heat dissipation must be ensured.
Technical data - general:
Technical data
Precision application
Professional application
Operating temperature range
-10°C … +85°C
-55°C … +155°C
Climatic category acc. EN 60068
10 / 85 / 56
55 / 155 / 56
Solderability acc. EN 60068-2-58
245°C 3s
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
± (0,05% +0,01R) at 260°C 10s
± (0,05% +0,01R) at 260°C 10s
Long time stability
Storage 155°C / 1000 h
± (0,1% +0,02R)
± (0,25% +0,05R)
Endurance P70 / 70°C / 1000 h
± (0,1% +0,02R)
± (0,25% +0,05R)
Endurance P70 / 70°C / 8000 h
± (0,25% +0,02R)
± (0,5% +0,05R)
Endurance P70 / 70°C / 225000 h1)
± (1,0% +0,02R)
± (1,5% +0,05R)
Damp heat, steady state (56d / 40°C / 96%)
± (0,1% +0,02R)
± (0,25% +0,05R)
1) calculated acc. Arrhenius
Data, unless specified, acc. EN 140401-801.
Download CMP
Sizes: 0402, 0603, 0805, 1206
Characteristics:
- Chip resistors in thin film technology
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) - low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- R-Value-Matching available
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available - also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
Dimensions (in mm):
Size
L
Length
W
Width
H
Depth
t
Contact
back
T
Contact
front
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0402
0,95
1,10
0,45
0,60
0,25
0,40
0,10
0,35
0,05
0,35
0603
1,50
1,70
0,75
0,95
0,35
0,55
0,10
0,50
0,10
0,50
0805
1,85
2,15
1,10
1,40
0,35
0,65
0,15
0,60
0,15
0,60
1206
2,90
3,35
1,45
1,75
0,35
0,65
0,25
0,75
0,15
0,75
Packaging units:
Reel
Card tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
10 T pcs. for size 0402
330 mm
10 T pcs.
20 T pcs.
Samples on request
Ordering information:
CMP
- N
0603
10k
0,1%
10ppm/K
K
P
5
(optional)
Type
Contact
Size
R-Value
± Tolerance
± TCR
Marking
Packaging
pcs. / Reel
(T pcs.)
CMP
Standard (without add.)
-N (non magnetic)
0402
.
to
.
1206
1R
.
to
.
4M7
0,05
0,1
0,25
0,5
1
10
15
25
50
K- with
(from size 0603)
N- without
(only size 0402)
P- Card tape
S- Bulk
Depends on size and packaging unit
Technical data – depending on size:
Type
Umax
(V)
P70
(W)
R-Range
R-Tolerance
(± %)
TCR
(± ppm/K)
Packaging
P
B
S
0402
50
0,100
100R – 47k0
0,1 / 0,25 / 0,5 / 1
153)
x
x
100R – 221k
0,1 / 0,25 / 0,5 / 1
25
x
x
100R – 511k
0,1 / 0,25 / 0,5 / 1
50
x
x
10R0 - 1M00
1
50
x
x
0603
75
0,125
1R00 - 10R0
0,5 / 1
50
x
x
10R0 - 100R
0,1 / 0,25 / 0,5 / 1
25
x
x
100R – 332k
0,05 / 0,1 / 0,25 / 0,5 / 1
102)
x
x
332k – 511k
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
511k - 1M50
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
0805
150
0,200
1R00 - 10R0
0,5 / 1
50
x
x
10R0 - 100R
0,1 / 0,25 / 0,5 / 1
25
x
x
100R – 511k
0,05 / 0,1 / 0,25 / 0,5 / 1
102)
x
x
511k - 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
1M00 - 2M00
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1206
200
0,400
1R00 - 10R0
0,5 / 1
50
x
x
10R0 - 100R
0,1 / 0,25 / 0,5 / 1
25
x
x
100R - 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
102)
x
x
1M00 - 2M00
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
2M00 - 4M71)
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1)10R – 100R from ±0,1% tolerance 2) TCR ±5 on request 3) TCR ±10 on request
Technical data - general:
Technical data
Operating temperature range
-55°C … +155°C
Climatic category acc. EN 60068
55 / 155 / 56
Solderability acc. EN 60068-2-58
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
± (0,05% +0,01R) at 260°C 10s
Long time stability
Storage 155°C / 1000 h
± (0,5% +0,05R)
Endurance P70 / 70°C / 1000 h
± (0,5% +0,05R)
Damp heat, steady state (56d / 40°C / 96%)
± (0,5% +0,05R)
Data, unless specified, acc. EN 140401-801.
Download CMV
Sizes: 1206, 2512
Characteristics:
- Chip resistors in thin film technology with higher voltage resistance
- High-precision resistor layers
- Resistance area coated with surface passivation
- Highest stability and reliability
- Very tight tolerances (=0,05%) - low temperature coefficient (=10ppm/K)
- Low current noise, good pulse strength
- RoHS-conform
- Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
- Customer specific barcodes available - also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
Dimensions (in mm):
Size
L
Length
W
Width
H
Depth
t
Contact back
T
Contact
front
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
1206
2,90
3,35
1,45
1,75
0,35
0,65
0,25
0,75
0,15
0,75
2512
6,10
6,50
3,00
3,30
0,50
0,75
0,35
0,85
0,25
0,85
Packaging units:
Reel
Card tape
Blister tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
4 T pcs.
330 mm
10 T pcs.
8 T pcs.
20 T pcs.
16 T pcs.
Samples on request
Ordering information:
CMV
- N
1206
500k
0,5%
25ppm/K
K
P
10
(optional)
Type
Contact
Size
R-Value
± Tolerance
± TCR
Marking
Packaging
pcs. / Reel
(T pcs.)
CMV
-Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
1206
2512
100k
.
to
.
4M7
0,05
0,1
0,25
0,5
1
10
25
50
K- only with
P- Card tape
B- Blister tape
S- Bulk
Depends on size and packaging unit
Technical data – depending on size:
Size
Umax
P70 1)
R-Range
R-Tolerance
(± %)
TCR
(± ppm/K)
Packaging
(V)
(W)
P
B
S
1206
300
0,25
100k – 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
10
x
x
1M00– 2M00
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
100k – 4M70
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
2512
1000
1
100k – 1M00
0,05 / 0,1 / 0,25 / 0,5 / 1
10
x
x
1M00 – 2M00
0,05 / 0,1 / 0,25 / 0,5 / 1
25
x
x
100k – 4M70
0,05 / 0,1 / 0,25 / 0,5 / 1
50
x
x
1)For continuous operation a sufficient heat dissipation must be ensured.
Technical data - general:
Technical data
Operating temperature range
-55°C … +155°C
Climatic category acc. EN 60068
55 / 155 / 56
Solderability acc. EN 60068-2-58
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
± (0,05% +0,01R) at 260°C 10s
Long time stability
Storage 155°C / 1000 h
± (0,25% +0,05R)
Endurance P70 / 70°C / 1000 h
± (0,25% +0,05R)
Damp heat, steady state (56d / 40°C / 96%)
± (0,25% +0,05R)
Data, unless specified, acc. EN 140401-801.
Download CMA
Sizes: 1206-4 (4 x 0603)
Characteristics:
- Chip resistors in thin film technology
- Four resistors with 2 circuit variants
- Concave contact
- Resistance area coated with surface passivation
- High stability and reliability
- RoHS-conform
- Customer specific barcodes available - also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
- Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery) - Epoxy bondable contact -K
Dimensions (in mm):
L
Length
W
Width
H
Depth
t
Contact back
WT
Contact width
P
Contact spacing
D
Contact radius
3,2 ± 0,10
1,6 ± 0,10
0,6 ± 0,10
0,3 ± 0,10
0,5 ± 0,10
0,8
0,3
Packaging units:
Reel
Card tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
330 mm
10 T pcs.
20 T pcs.
Samples possible up to 50 pcs./value
Ordering information:
Circuit type 1 CMA
-N
1206-4
4k7
1%
50ppm/K
N
P
10
(optional)
Type
Contact
Size
R-Value R1;R2;R3;R4
± Tolerance
± TCR
Marking
Packaging
pcs. / Reel
(T pcs.)
CMA
-Standard (without add.)
-N (non magnetic)
-K (epoxy bondable)
1206-4
100R
.
to
25k
0,25
0,5
1
25
50
N- only without
P- Card tape
S- Bulk
5
10
20
Circuit type 2 CMA
-N
1206-4
4k7
6k8
1%
50ppm/K
N
P
10
(optional)
Type
Contact
Size
R-Value R1;R4
R-Value R2;R3
± Tolerance
± TCR
Marking
Packaging
pcs./Reel
(T pcs.)
CMA
-Standard (without add.)
-N (non magnetic)
-K (epoxy bondable)
1206-4
100R
.
to
.
25k
100R
.
to
.
25k
0,25
0,5
1
25
50
N- only without
P- Card tape
S- Bulk
5
10
20
Technical data – depending on size:
Size
Nominal
voltage Umax (V)
Load P70 (W)
R-Range
Absolute
R-Tolerance (± %)
Matching
R-Tolerance
(± %)
Absolute
TCR
(± ppm/K)
Tracking
TCR
(± ppm/K)
Packaging
P
B
S
1206-4
50
4 x 0,063
100R – 25k
± 0.25
0,1
± 25
25
x
x
1206-4
50
4 x 0,063
100R – 25k
± 0.5
0,25
± 25
25
x
x
1206-4
50
4 x 0,063
100R – 25k
± 0.25
0,1
± 50
50
x
x
1206-4
50
4 x 0,063
100R – 25k
± 0.5
0,5
± 50
50
x
x
Circuit type:
Type
CMA 1206-4
1
R1=R2=R3=R4
2
R1=R4 ; R2=R3
Ratio Rmin/Rmax on request
Technical data - general:
Technical data
Operating temperature range
-55°C … +155°C
Climatic category acc. EN 60068
55 / 155 / 56
Solderability acc. EN 60068-2-58
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
± (0,1% + 0,05R) at 260°C 10s
Long time stability
Storage 155°C / 1000 h
± (0,5% +0,05R)
Endurance P70 / 70°C / 1000 h
± (0,25% +0,05R)
Damp heat, steady state (56d / 40°C / 96%)
± (0,25% +0,05R)
Data, unless specified, acc. EN 140401-801.
Download CMF-Jumper
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- Chip resistors in thin film technology
- RoHS-conform
- Customer specific barcodes available - also in 2D
- Electroplated pure tin
Dimensions (in mm):
Size
L
Length
W
Width
W1
Width
H
Depth
t
Contact
back
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0402
0,95
1,10
0,45
0,60
0,25
0,40
0,25
0,40
0,10
0,35
0603
1,50
1,70
0,75
0,95
0,50
0,70
0,35
0,55
0,10
0,50
0805
1,85
2,15
1,10
1,40
0,80
1,10
0,35
0,65
0,15
0,60
1206
2,90
3,35
1,45
1,75
1,00
1,30
0,35
0,65
0,15
0,75
1210
3,00
3,30
2,35
2,65
0,50
0,75
0,35
0,85
0,25
0,85
1218
3,00
3,30
4,50
4,80
0,50
0,75
0,35
0,85
0,25
0,85
2010
4,80
5,20
2,30
2,70
0,50
0,75
0,35
0,85
0,25
0,85
2512
6,10
6,50
3,00
3,30
0,50
0,75
0,35
0,85
0,25
0,85
Packaging units:
Reel
Card tape
Blister tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
4 T pcs.
10 T pcs. for size 0402
330 mm
10 T pcs.
8 T pcs.
20 T pcs.
16 T pcs.
Samples on request
Ordering information:
CMF
0805
0R
N
P
5
(optional)
Type
Contact
Size
R-Value
Marking
Packaging
pcs. / Reel
(T pcs.)
CMF
Standard (without add.)
0402
to
2512
0R
N- only without
P- Card tape
B- Blister tape
S- Bulk
Depends on size and packaging unit
Technical data – depending on size:
Size
Max.
current
Max.
R-Value
Insulation voltage
Uins (V)
Packaging
Imax (A)
Rmax (mOhm)
1 min
Continuous
P
B
S
0402
1,5
20
75
75
x
x
0603
2,00
20
100
75
x
x
0805
2,50
20
200
75
x
x
1206
3,50
20
300
75
x
x
1210
4,00
20
300
75
x
x
1218
7,00
20
300
75
x
x
2010
5,00
20
300
75
x
x
2512
7,00
20
300
75
x
x
Technical data - general:
Technical data
Operating temperature range
-55°C … +155°C
Solderability acc. EN 60068-2-58
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
260°C 10s
Data, unless specified, acc. EN 140401-801.
Download CPT
Sizes: 0805, 1206
Characteristics:
- Temperature sensors in thin film technology
- Wide area of temperature measurement from -50 to +150°C
- Standardized nominal values and tolerances
- High measurement accuracy and good long time stability
- Good linear characteristic curves
- Varnish passivation
- Galvanic wrap-around contact with diffusion barrier
- Suitable for automatic large-scale production
- Tape packaging acc. DIN IEC 286-3
- RoHS-conform
Dimensions (in mm):
Size
L
Length
W
Width
H
Depth
T/t
Contact
0805
2,00±0,2
1,30±0,2
0,50±0,2
0,40±0,2
1206
3,10±0,2
1,50±0,2
0,80±0,2
0,50±0,2
Packaging units:
Reel
Card tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
330 mm
10 T pcs.
20 T pcs.
Samples on request
Ordering information:
CPT
0805
1k
B
K
P
5
(optional)
Type
Size
R-Value
Class
Marking
Packaging
pcs. / Reel
(T pcs.)
CPT
0805
1206
100R
500R
1k
Temperature range
Class B
K- only with
P- Card tape
S- Bulk
Depends on size and packaging unit
Technical data:
Nominal R-Values:
100 Ohm, 500 Ohm, 1000 Ohm at 0°C
Temperature coefficient:
a = 3,850 x 10-3/°C (between 0 and 100°C)
Temperature range:
-50 ... +150°C
Tolerance:
Temperature range Class B: -50 to +150°C
Measurement current:
Pt 500
0,7mA recommended
Pt 1000
0,1mA recommended
Maximum current:
Pt 500
3,0mA
Pt 1000
1,0mA
Long time stability:
max. R0-Drifting = 0,05% / Year
Insulation R-Value:
>10M at room temperature
Self-heating:
?t = I2 * R * E Soldering connections:
Electroplated tinned wrap-around contact with diffusion barrier
Solderability, see DIN IEC 68 Part 2
Processing:
Reflow soldering (Soldering temperature/time = 240°C / 8s)
Flood soldering (Soldering temperature/time = 260°C / 10s)
SMD-Sizes:
The types CPT 0805 and CPT 1206 are produced acc. CECC 40401-004/DIN 45 921.
Operating conditions:
Platinum-Temperature sensors may not be used unprotected inside moist environments or inside aggressive atmospheres. It’s necessary to perform a check by the user before using inside applications.
Packaging:
Card tape, small quantities also as bulk
Storage:
Inside tape packaging (standard), Platinum-Temperature sensors can be stored under normal environment conditions at least 12 month.
Download CTP
Sizes: 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
- RoHS-conform
- Customer specific barcodes available - also in 2D
- All sizes can be manufactured with the following contact variants
- Electroplated pure tin
Dimensions (in mm):
Size
L
Length
W
Width
W1
Width
H
Depth
t
Contact
back
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
0603
1,50
1,70
0,75
0,95
0,50
0,70
0,35
0,55
0,10
0,50
0805
1,85
2,15
1,10
1,40
0,80
1,10
0,35
0,65
0,15
0,60
1206
2,90
3,35
1,45
1,75
1,00
1,30
0,35
0,65
0,25
0,75
1210
3,00
3,30
2,35
2,65
0,50
0,75
0,35
0,85
0,35
0,85
1218
3,00
3,30
4,50
4,80
0,50
0,75
0,35
0,85
0,35
0,85
2010
4,80
5,20
2,30
2,70
0,50
0,75
0,35
0,85
0,35
0,85
2512
6,10
6,50
3,00
3,30
0,50
0,75
0,35
0,85
0,35
0,85
Packaging units:
Reel
Card tape
Blister tape
Ø
acc. EN 60286-3
180 mm
5 T pcs.
4 T pcs.
330 mm
10 T pcs.
8 T pcs.
20 T pcs.
16 T pcs.
Samples on request
Ordering information:
CTP
0805
P
5
(optional)
Type
Size
Packaging
pcs. / Reel
(T pcs.)
CTP
0603
to
2512
P- Card tape
B- Blister tape
S- Bulk
Depends on size and packaging unit
Technical data:
This test points, as well as other SMD elements, can be automatically loaded and allow control measurements on the finished board. The contact surface is coated with a solid, electroplated SnNi layer.
Technical data - general:
Technical data
Solderability acc. EN 60068-2-58
245°C 3s
Soldering heat resistance acc. EN 60068-2-58
260°C 10s
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